Distinguished Engineer (Chiplet Lead - Photonic Fabric)

ASIC / SoC development

Strong experience across Micro‑architecture and RTL design, high‑speed

, physical design and sign‑off, DFT and manufacturing test, advanced packaging and chiplet‑style integration, post‑silicon bring‑up, ATE, and system validation.

clearly articulate architectural and implementation tradeoffs

across performance, power, area, yield, cost, schedule, and risk.

across cross‑functional teams with differing viewpoints in a matrixed environment and drive solutions to tough engineering problems across the product stack.

209,770 - 314,300, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.

The expected base pay range for this role may be modified based on market conditions.

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips.

In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity.

The Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions.

The Photonic Fabric™ includes optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB).

This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs.

The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes.

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.