andurilindustries
Wire Bonding Technician
At a Glance
- Location
- Lexington, Massachusetts, United States
- Department
- Imaging
- Posted
- 2026-03-11T12:55:08-04:00
Key Requirements
Required Skills
Domain Knowledge
- Automation
- Banking
- Education
- Finance
- Healthcare
- Insurance
- Legal
- Medical
Benefits & Perks
toward your private health insurance for you and your dependents. Additional
Requirements
Experience working with precision test and measurement equipment for development or production hardware.
Experience collecting data from devices under test (DUTs) using test and inspection equipment.
Experience working with delicate hardware such as microelectronics assemblies and performing ultra fine motor skill tasks.
Experience with microelectronics packaging such as wirebonders.
Experience with electrical cabling assemblies, soldering, crimping and debug.
Proficiency with SolidWorks and scripting/automation languages (MATLAB, Python, LabVIEW).
Responsibilities
We are seeking a Micro-electronics Technician to join our team, focusing on the packaging and assembly of custom infrared image sensors.
In this role, you will collaborate with engineers in a cleanroom environment to handle and test silicon wafers, wire bond image sensors into ceramic packages, and perform visual and electrical inspections of sensor chip assemblies.
Your expertise will be essential in operating custom test equipment to collect image data.
Work with engineers to package, test and assemble custom infrared image sensors in a clean room environment.
Handle and test silicon wafers in automated probe test station.
Handle, mount, and wirebond image sensors into custom ceramic packages using a wire ball bonder.