Technologist, Packaging Engineering

Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout

Additional expertise in die attach, wire bonding, wafer thinning, and molding processes is a plus

Experience with machine learning and data analytics utilizing AI technologies

Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives

Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.

Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies

Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the "

Know Your Rights: Workplace Discrimination is Illegal

” poster. Our pay transparency policy is available

here

.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States.

In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines.

You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards.

The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology.

Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.

Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross‑functional engineering teams, global factories, and key stakeholders.

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.