Full-Chip Physical Design Verification Engineer

A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure.

A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces.

A mentor and technical leader passionate about building efficient, manufacturable silicon.

BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verification experience.

Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification using industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.).

Strong background in ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM), with solid understanding of advanced nodes (7nm, 5nm, 3nm) and FinFET design challenges.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.  Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).   These requirements apply to persons located in the U.S. and all countries outside the U.S.  As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.  If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.