Sr. Engineer, Package Design

An experienced PCB designer looking to expand into advanced semiconductor packaging and package-board co-design.

Interested in understanding how package architecture, BGA design, and board implementation influence overall system performance.

Motivated by solving complex routing, connectivity, and electrical design challenges.

Excited to apply automation, data analytics, and emerging AI techniques to improve engineering workflows.

3+ Years experience with Cadence Allegro PCB Designer.

Experience with high-pin-count BGAs and complex connectivity requirements.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.  Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).   These requirements apply to persons located in the U.S. and all countries outside the U.S.  As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.  If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.