Optical Test Engineer, Principal

Co-Packaged Optics (CPO)

, silicon photonics, or high-speed optical transceivers (800G/1.6T+).

Proven track record developing optical test solutions for wafer, package, or module-level testing in high-volume environments.

Deep expertise in optical test instrumentation (e.g., optical spectrum analyzers, BER testers, oscilloscopes, tunable lasers, power meters, fiber alignment systems).

Experience with automated test equipment (ATE), Python/LabVIEW/C# test development, and statistical process control (SPC).

Knowledge of PAM4 signaling, signal integrity, mixed-signal testing, and reliability standards for data center optics.

Lead the definition, development, and qualification of comprehensive test solutions for CPO optical engines, including wafer-level, die-level, package-level, and system-level testing.

Design and implement optical test hardware and automation systems (e.g., active alignment, fiber array attachment, high-speed optical I/O characterization).

Develop test programs and methodologies for key photonic parameters: insertion loss, eye diagrams, BER, PAM4 signaling, optical power, wavelength, thermal performance, and reliability stress testing.

Collaborate closely with Silicon Photonics design, package engineering, product engineering, and manufacturing teams to optimize design-for-test (DFT) and manufacturability.

Drive yield improvement, failure analysis, and root-cause investigations for complex electro-optical failures in CPO assemblies.

Establish correlations between bench/lab validation, ATE production test, and system-level performance.