vardaspace
Mechanisms Engineer - Payloads
At a Glance
- Location
- El Segundo, California, United States
- Compensation
- nge Salary Range: Engineer I: $104,000.00 - $130,000.00/per year Engineer II: $114,00
- Posted
- 2026-04-30T20:03:05-04:00
Key Requirements
Domain Knowledge
- Aerospace
- Engineering
- Environmental
- Government
Benefits & Perks
erns excluded) Unlimited PTO (interns excluded) Health ins
(interns excluded) Health insurance, including Vision and Dental Lunch and
Requirements
BS/BEng in Mechanical, Aerospace, Mechatronics, or related engineering discipline
Strong fundamentals in structures, heat transfer, fluids, and dynamics
Hands-on experience designing, integrating, testing, and troubleshooting electromechanical hardware
Experience integrating electromechanical actuators, sensors, thermal control hardware and/or fluid control hardware
Experience using CAD (NX preferred) and FEA (Ansys, Nastran)
Exposure to aerospace environmental testing (vibration, TVAC, EMI/EMC)
Compensation & Benefits
Salary Range:
Engineer I: $104,000.00 - $130,000.00/per year
Engineer II: $114,000.00 - $145,000.00/per year
This role is on-site
in El Segundo, CA
Leveling and base salary is determined by job-related skills, education level, experience level, and job performance
Responsibilities
As a Mechanisms Engineer on Varda’s Payload team, you will develop electromechanical flight hardware that operates in orbit, endures hypersonic reentry, and returns to Earth for inspection and iteration.
You will take full-stack responsibility for payloads across both pharmaceutical manufacturing and hypersonic reentry testbed missions—delivering flight hardware from concept through build, test, launch, and recovery.
You’ll collaborate closely with internal specialists and external partners, translate engineering requirements into flight-ready designs, and perform hands-on integration and testing to deliver hardware that flies in months, not years.
This role is ideal for engineers with strong mechanical fundamentals who want to grow their breadth across thermal, fluids, avionics, software, and integration while shipping real hardware to space and back.
Own payload hardware from concept through design, integration, launch, reentry, and recovery
Design mechanisms, structures, thermal/fluid interfaces, and electromechanical assemblies