Senior Thermal Engineer - TeraWave

7+ years of thermal engineering experience in electronics hardware, with direct experience on high-power-density, densely packed consumer or telecom hardware (RF systems, base stations, networking equipment, or similar).

Proficiency in industry-standard thermal simulation tools (e.g., Ansys

FLOTHERM, 6SigmaET, or equivalent) for both component-level and system-level thermal modeling.

Demonstrated experience designing passive thermal solutions (no fans/active cooling) for sealed or environmentally exposed electronics enclosures.

Direct experience solving thermal challenges within IP-rated sealed enclosures, understanding tradeoffs between weatherproofing and heat rejection.

Strong working knowledge of thermal interface materials (TIMs), gap fillers, thermally conductive potting/adhesives, and their tradeoffs (thermal conductivity, cost, reliability, assembly process).

Benefits include:  Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.

Stock Options for all regular employees (working at least 20 hours/week)

Paid Time Off:  Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.

Define the overall thermal management strategy for the user terminal, balancing passive cooling requirements against cost, weight, and form-factor constraints typical of consumer/enterprise hardware.

Build and maintain detailed thermal models (CFD and FEA) of the full system — PCB, enclosure, beamforming ICs, power electronics — to predict junction temperatures, hot spots, and derating requirements under worst-case operating conditions.

Work with RF and EE teams to build system-level power dissipation budgets, identifying high-heat-flux components (BFICs, power amplifiers, PMICs, processors) early in the design cycle.

Design and specify heat spreading and dissipation solutions — heat sinks, heat pipes, vapor chambers, thermal interface materials (TIMs), and PCB thermal via/copper strategies — in collaboration with PCB and mechanical teams.

Solve the specific challenge of passive heat rejection from a sealed (IP67+) outdoor enclosure without compromising weatherproofing, including consideration of convection, radiation, and conduction paths to the external environment.

Ensure thermal designs meet operational requirements across full environmental spec (e.g., -40°C to +65°C ambient, solar loading, altitude, humidity) and support environmental qualification testing (HALT/HASS, thermal cycling, thermal shock).