Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging

Zipline builds autonomous aircraft that operate in demanding real-world environments where electronic systems must continue to function through vibration, shock, temperature extremes, weather exposure, manufacturing variation, and years of fleet operation.

The reliability of an electronic module depends not only on its electrical design, but also on its structural integrity, thermal performance, packaging architecture, material selection, fastening strategy, and interactions with surrounding assemblies.

As a Simulation Engineer for Avionics, you will own the simulation strategy that enables robust electronic hardware from concept through production and fleet deployment.

You will develop structural, thermal, and multi-physics models that predict how avionics, compute modules, sensors, communication systems, and power electronics behave throughout their operating life.

Your work will directly influence architecture decisions, design margins, manufacturing approaches, and validation strategies before hardware is built.

You will work closely with Mechanical, Electrical,

Own the simulation strategy for electronic modules and electromechanical assemblies throughout concept development, design, validation, production ramp, and field support.

Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.

Perform static structural analyses including contact mechanics, bolt preload, fastener retention, housing deformation, sealing interfaces, component stresses, and structural load paths.

Perform dynamic analyses including modal, harmonic response, random vibration, shock, and fatigue to evaluate durability throughout transportation, manufacturing, and flight environments.

Develop thermal simulations for electronics cooling using conduction, convection, and radiation to ensure components remain within operating limits during all mission phases.

Support development of cooling architectures including blowers, ducts, heat sinks, vapor chambers, thermal interface materials, cold plates, and enclosure ventilation.